There has been a pressing trend to miniaturize products while enhancing their performances. The success depends not only on the product design, but also on manufacturing capability for micro/nano components. Although lithography-based techniques can be used to produce microcomponents as in microelectronics, they are expensive and inflexible. This novel FIEM process (Focused Ion Etching & Molding) provides a new technology to produce micro/nano components by: 1) Extending the capability of a focused ion beam to fabricate 3D micro/nano mold cavities, 2) Capitalizing on the matured injection technology for large- volume micromolding, and 3) Complementing the current LIGA technique for 3D fabrication.